AI liquid-cooled server cleanliness inspection
The Importance of Cleanliness Testing for AI Liquid Cooling SystemsStatistics show that over 60% of early failures in liquid cooling systems (such as localized chip overheating and abnormal pump and

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The Importance of Cleanliness Testing for AI Liquid Cooling Systems

Statistics show that over 60% of early failures in liquid cooling systems (such as localized chip overheating and abnormal pump and valve wear) are directly related to contaminants. The cost of system downtime and maintenance due to inadequate cleanliness can reach 15%-20% of the initial investment.

AI Liquid Cooling Service Cleanliness Testing Solutions

I. Flushing and Collection + Particle Analysis (Indirect Quantitative Detection)

Components are connected to an automatic flushing and extraction device (with adjustable flushing flow rate of 0.5-80 L/min). High-purity deionized water (resistivity ≥18.2 MΩ·cm) or anhydrous ethanol is used as the extraction medium. Through a combination of flushing and air purging, particles detached from the surface and interior of the components are efficiently collected onto a filter membrane. A cleanliness automatic analysis system then performs a one-click scan to accurately identify and statistically analyze the number, size, and distribution of metal and non-metal microscopic particles.


II. Scanning Electron Microscope (SEM) + Energy Dispersive Spectrometer (EDS) (For Root Cause Analysis)

When the system experiences blockage or abnormal wear, in-depth morphological and compositional analysis of residual particles on the inner wall of the components is required to accurately locate the source of contamination:

• Morphological analysis: SEM is used to observe the particle morphology (e.g., whether they are regular metal shavings, irregular wear debris, etc.) to determine the cause of particle generation (processing residue, operational wear, etc.);

• Compositional analysis: EDS is used to detect the elemental composition of the particles (e.g., Cu, Al, Fe, etc.) to further trace the source of contamination (e.g., copper pipe processing residue, wear of aluminum quick-connect fittings, external impurity intrusion, etc.).


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